Power chips are connected to outside circuits with packaging, and their performance depends on the assistance of the product packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip interconnection refers to the electric link on the top surface of the chip, which is generally aluminum bonding cord in conventional modules. ^
Typical power component bundle cross-section
At present, business silicon carbide power modules still mostly make use of the packaging technology of this wire-bonded traditional silicon IGBT component. They face problems such as large high-frequency parasitical specifications, insufficient heat dissipation capability, low-temperature resistance, and inadequate insulation strength, which limit using silicon carbide semiconductors. The screen of outstanding performance. In order to solve these problems and totally exploit the big prospective advantages of silicon carbide chips, numerous new packaging modern technologies and remedies for silicon carbide power components have emerged in the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold wire bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold cords to copper wires, and the driving pressure is expense decrease; high-power gadgets have actually created from light weight aluminum cords (strips) to Cu Clips, and the driving force is to improve product efficiency. The greater the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared to standard bonding product packaging methods, Cu Clip technology has the adhering to advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a specific degree, replaces the common cord bonding method between the chip and the pins. For that reason, an unique package resistance value, greater current flow, and better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can completely conserve the price of silver plating and inadequate silver plating.
3. The product appearance is entirely regular with typical items and is mainly used in web servers, mobile computers, batteries/drives, graphics cards, motors, power products, and various other fields.
Cu Clip has two bonding approaches.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding method is extra expensive and complex, yet it can attain much better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cable bonding approach
The source pad makes use of a Clip approach, and eviction makes use of a Cable approach. This bonding approach is a little less costly than the all-copper bonding technique, conserving wafer location (appropriate to very small gate locations). The procedure is less complex than the all-copper bonding technique and can acquire much better Rdson and better thermal impact.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper price per kg, please feel free to contact us and send an inquiry.
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